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We provide quality
PCB fabrication service
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Flex and Rigid-Flex
PCB Fabrication Ability |
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 Flex and Rigid-Flex PCB Fabrication Capacity
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| Item |
PI |
PET |
Note |
| Layers |
1～8 Layers |
1～2 Layers |
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| Wire Width |
1-Layer |
0.1mm (4mils)
(<=0.0mil) |
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| Multi-Layer |
0.1mm
(4mils) |
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| Hole Diameter |
Drilling Hole |
0.27mm (10.63mil)
(Diameter) |
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| Punch Hole |
0.50mm (19.69mil )
(Diameter) |
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| Tolerance |
Wire |
-/+ 0.02mm (-/+ 0.79mil) |
<=0.5mm
(<=0.0mil) |
| Hole |
-/+ 0.02mm (-/+ 0.79mil) |
<=1.5mm
(<=0.1mil) |
| Distance |
-/+ 0.05mm (-/+ 1.97mil) |
<=25mm
(<=1.0mil) |
| BD Border |
-/+
0.3mm (-/+ 11.81mil)～0.1mm (3.94mil) |
<=50mm
(<=2.0mil) |
| Spacing |
-/+ 0.1mm (-/+ 3.94mil) |
<=5.0mm
(<=0.2mil) |
| Finger |
-/+ 0.1mm (-/+ 3.94mil) |
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| Surface Process |
Immersion Gold: 0.05um(0.0mil)～1.25um(0.0mil)
Plate
Solder: 2um(0.1mil)～10um(0.4mil)
HASL: 20um (0.8mil) or More
Organic
Solderability Preservatives |
Adjustable |
| Insulation |
500MΩ |
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| Dielectric Constant |
3.5（102-108Hz） |
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| Peelable Resistance |
1.0kgf/cm |
1.2hgf/cm |
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| Temperature |
-200℃(-328ºF)～+300℃(+572ºF) |
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| Bending Ability |
500000 or More Times |
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| Flex and Rigid-Flex PCB Material Note |
| Item |
PI |
PET |
| Base Material |
12.5um (0.5mil), 25um (1.0mil)
50um (2.0mil), 75um (3.0mil)
125um (4.9mil) |
25um(1.0mil), 50um (2.0mil)
75um (3.0mil), 100um (3.9mil) |
| Cover Film |
12.5um (0.5mil), 25um (1.0mil),
50um (2.0mil), 75um (3.0mil) |
25um (1.0mil), 50um (2.0mil) |
| Copper Thickness |
18um (0.7mil), 35um (1.4mil), 50um (2.0mil), 70um (2.8mil) |
| Copper
Material |
ED
RA |
| Green color means default selection.
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