PCB Fabrication Capabilities
| Technology index | |||
| Layer counts | 0-20L | ||
| CEM FR4; High Tg FR4; PTFE; Aluminum base; Rogers | |||
| Board thickness | 0.01inch/0.20mm-0.24inch/6.0mm | ||
| Board thickness tolerance | +/-10% | ||
| Maximum board size | 20.08inch/510mm x 47.01inch/11s94mm | ||
| Board outline tolerance | +/-3.94mil (+/-0.10mm) | ||
| Drilling hole size (Mechanical) | 7.87mil/0.20mm | ||
| Finished hole size (Mechanical) | 3.94mil/0.10mm | Registration (Mechanical) | +/-0.075mm (2.95mil) |
| Aspect Ratio | 10:1 | ||
| Multi-Layer PCB External Copper Thickness | 0.5oz/18um -- 4oz/140um | ||
| 1 and 2 layer PCB External Copper Thickness | 0.5oz/18um -- 9oz/315um | ||
| Internal layer copper thickness | 0.5oz/18um -- 4oz/140um | ||
| PTH wall copper thickness | 0.5-1.4mil/12-35um | ||
| Minimum impedance control line width | 4.5mil/0.11mm | ||
| Dielectric thickness between layers | 2.95-196.85mil/0.075-5.0mm | ||
| Solder mask type | LPI | ||
| Minimum Solder mask dam | 3.94mil/0.10mm | ||
| Minimum solder mask clearance | 1.97mil/0.05mm | ||
| Maximum plug hole size | 23.62mil/0.60mm Max | ||
| Designed Conductor Width/ Space (Minimum) | 4.0mil/0.10mm | ||
| Impedance Tolerance of Finished Board (Minimum) | +/-10% | ||
| Surface finish | HASL (thickness) | 1-25um/2-50um | |
| Lead Free HASL (thickness) | 1-25um/2-50um | ||
| Electroless Nickel Immersion Gold(thickness) | >0.002mil (>0.05um) | ||
| Immersion Silver (thickness) | 0.006mil/0.15um-0.03mil/0.75um | ||
| Immersion Tin (thickness) | >0.04mil (>1.0um) | ||
| OSP (thickness) | 0.008mil/0.2um-0.02mil/0.5um | ||
| Flash gold (thickness) | >0.02mil (>0.05um) | ||
| Peelable solder mask (thickness) | 0.30mm min | ||
| Gold fingers (thickness) | 3u"-30u" | ||
| Bare board test | E-Test | Maximum testing points | 64512 points (both side) |
| Maximum testing board size | 16.97inch/431mm x 37.20inch/945mm | ||
| Minimum testing pad size | 7.87mil/0.20mm | ||
| Minimum testing pad pitch | 11.81mil/0.30mm | ||
| Maximum testing voltage | 300v | ||
| Maximum testing insulating resistance | 100MΩ | ||
| Minimum testing Continuity resistance | 5MΩ | ||
| Flying Probe | Maximum testing points | no restrict | |
| Maximum testing board size | 15.94inch/405mm x 24.02inch/610mm | ||
| Minimum testing pad size | 5.91mil/0.15mm | ||
| Minimum testing pad pitch | 11.81mil/0.30mm | ||
Check quote webpage to find the different answers for different pre-condition.